London
4rd IEEE International Workshop on Smart Communication
Protocols and Algorithms (SCPA 2015)
in conjunction with IEEE ICC'15
June 8-12, 2015. London, UK
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General Chairs

  • Jaime Lloret Mauri, Universitat Politècnica València, Spain
  • Joel Rodrigues, Instituto de Telecomunicações, Univ. of Beira Interior, Portugal

TPC Chairs

  • Ivan Stojmenovic, University of Ottawa, Canada
  • Guangjie Han, Hohai University, China

Panel Chairs

  • Honggang Wang, University of Massachusetts, USA
  • Daqiang Zhang, Tongji University, China

Industry Chairs

  • Antonio Sánchez-Esguevillas, Telefonica R&D, Spain
  • Neeraj Kumar, Thapar University, Patiala (Punjab), India

Publicity Chair

  • Sandra Sendra, University of Beira interior, Portugal; Polytechnic University of Valencia, Spain

Web Chair

  • Alejandro Cánovas Solbes, Universitat Politècnica València, Spain

TPC Members

  • Ash Mohammad Abbas, Aligarh Muslim University, India
  • Javier Aguiar, University of Valladolid, Spain
  • Habib M. Ammari, Norfolk State University, USA
  • Carlos Baladron, University of Valladolid, Spain
  • Anwer Al-Dulaimi, Brunel University, UK
  • Saba AL-Rubaye, Brunel University, UK
  • Alvaro Araujo, Universidad Politécnica Madrid, Spain
  • Swastik Brahma, Syracuse University, USA
  • Dumitru Dan Burdescu, University of Craiova, Romania
  • Carlos Calafate, Universidad Politécnica de Valencia, Spain
  • Maria-Dolores Cano, Technical University of Cartagena, Spain
  • Phan Cong-Vinh, NTT University, Vietnam
  • Daniel Benevides da Costa, Federal University of Ceara (UFC), Brasil
  • Sofiane HAMRIOUI, Université des Sciences et de la Technologie Houari-Boumediene, Algerie
  • Isabel de la Torre, University of Valladolid, Spain
  • George Dimitrakopoulos, Harokopion University of Athens, Greece
  • Christos Douligeris, University of Piraeus, Greece
  • Ruifeng Duan, University of Vaasa, Finland
  • Deyun Gao, Beijing Jiaotong University, China
  • Miguel Garcia, Universidad Politecnica de Valencia, Spain
  • Sudhanshu Gaur, Hitachi America Ltd., USA
  • Marc Gilg, University of Haute-Alsace, France
  • Philipp Glatz, Delft University of Technology, Nederland
  • Zhangyu Guan, Shandong University, China
  • Jose M. Jimenez Herranz, Universidad Politécnica de Valencia, Spain
  • Amjad Mehmood, Kohat University of Science & Technology, Pakistan
  • Haiwu He, INRIA, France
  • T. Russell Hsing, Telcordia Technologies, USA
  • Hong Ji, Beijing University of Posts and Telecommunications, China
  • Minglu Jin, Dalian University of Technology, China
  • Lisimachos Kondi, University of Ioannina, Greece
  • Yunxin (Jeff) Li, NICTA, Australia
  • Xiaodong Lin, University of Ontario Institute of Technology, Canada
  • David Liu, Indiana University - Purdue University Fort Wayne, USA
  • Rong Ke Liu, Beihang University, China
  • Jonathan Loo, Middlesex University, UK
  • Juan Lopez-Soler, University of Granada, Spain
  • Pascal Lorenz, University of Haute Alsace, France
  • Gregorio Martinez Perez, University of Murcia, Spain
  • Keivan Navaie, University of Leeds, Canada
  • Muaz Niazi, COMSATS Institute of IT, Islamabad Pakistan
  • Octavio Nieto-Taladriz, Universidad Politécnica de Madrid, Spain
  • António Nogueira, University of Aveiro/Instituto de Telecomunicações, Portugal
  • Symeon Papavassiliou, I. of Com. and Comp. Syst/National Tech. Univ. of Athens, Greece
  • David Lizcano, Universidad a Distancia de Madrid, Spain
  • Al-Sakib Khan Pathan, International Islamic University Malaysia (IIUM), Malaysia
  • Adrian Popescu, Blekinge Institute of Technology, Sweden
  • Jorge Sá Silva, University of Coimbra, Portugal
  • Muhammad Shakir, King Abdullah University of Science and Technology, Saudi Arabia
  • Lei Shu, Guangdong University of Petrochemical Technology, China
  • Rahul Sinha, Illinois Institute of Technology, USA
  • Houbing Song, University of Virginia, USA
  • Alvaro Suárez-Sarmiento, University of Las Palmas de Gran Canaria, Spain
  • João Manuel R. S. Tavares, Faculdade de Engenharia, Universidade do Porto, Portugal
  • George Tombras, National and Kapodistrian University of Athens, Greece
  • Binod Vaidya, University of Ottawa, Canada
  • Wei Wang, Zhejiang University, China
  • Wei Wei, Xi’an Jiaotong University, China
  • Carlos Becker Westphall, Federal University of Santa Catarina, Brasil
  • Dalei Wu, Massachusetts Institute of Technology, USA
  • Jinsong Wu, Bell Laboratories, USA
  • Elsa Macias, University of Las Palmas de Gran Canaria, Spain
  • Feng Xia, Dalian University of Technology, China
  • Bashir Yahya, University of Versailles, France
  • Suk-Un Yoon, Lehigh University, USA
  • Fei Zesong, Beijing Institute of Technology, China
  • Xing Zhang, Beijing University of Posts and Telecommunications, China
  • Yao Zhao, Beijing Jiaotong University, China
  • Liang Zhou, Nanjing University of Posts and Telecommunications, China
  • Rajput Nitendra, IBM Research
  • Benoît Parrein, University of Nantes, France
  • Carlos Cambra Baseca, Technology and Advanced Solutions Center, Barcelona, Spain
  • Kayhan Zrar Ghafoor, Universiti Teknologi Malaysia, Malaysia
         
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